邻甲酚醛环氧树脂
邻甲酚醛环氧树脂，由于其分子结构具有多环氧基结构，固化后生产交联键多而紧密的结构，因而其固化产物具有优良的热稳定性、机械强度、电绝缘性和耐化学品性。主要用于微电子行业，被广泛应用于半导体器件、集成电路等分装材料。
0— Cresol Formaldehyde Epoxy Resin
Due to the multi-epoxy groups existing in the molecules of 0—cresol formaldehyde epoxy resin, a large amount of tight cross—bondsare formed after being cured,tesulting in excellent thermal stability, mechanical strength, electricity insulateon and chem.icals resistance. It is mainly used in microelectronic Industry. Widely used for the encapsulant of semiconductors and integrated circuits.
产品技术指标：Specifications:
|
序
号
No |
牌号
Brand |
环氧当量
Epoxy
Equivalent
(g/eq) |
可水解氯,%
(质量分数)
Hydrolysable
Chlorine Wt%
≤ |
无机氯,%
(质量分数)
Inorgano
Chlorine,Wt%
≤ |
软化点
Softening
Point
(℃) |
熔融粘度
Melting
Viscosity
(150℃) |
挥发份,%
(质量分数)
Volatile,
Wt% |
色度
(加德纳法)
Color
(Gardner)
≤ |
主要用途
Application |
|
1 |
CYDCN-100 |
195-210 |
0.015 |
0.0005 |
60~70 |
180~340 |
0.15 |
2 |
塑封料
电子油墨
层压板等
Encapsulant,electronic printing ink, laminates |
|
2 |
CYDCN-200 |
195-210 |
0.015 |
0.0005 |
60~75 |
340~480 |
0.15 |
2 |
|
3 |
CYDCN-200H |
195-210 |
0.015 |
0.0005 |
60~75 |
480~600 |
0.15 |
2 |
|
4 |
A001-09 |
195-210 |
0.015 |
0.0005 |
60~75 |
420~500 |
0.10 |
2 |
|
5 |
CYDCN-300 |
200-220 |
0.015 |
0.0005 |
75~85 |
— |
0.15 |
2 |
电子油墨
Electronic
Printing ink |
|
6 |
CYDCN-400 |
200-230 |
0.015 |
0.0005 |
85~95 |
— |
0.15 |
2 |
|
